Localized and Mask-less Copper Deposition with Free-flow Jet Micro-Electrochemical Additive Manufacturing

Micro-electrochemical additive manufacturing (μECAM) is reverse of electrochemical micro-machining (μECM) which used for selective and localized deposition material on a substrate. It can be to manufacture small sized parts or deposit functional metal coatings conductive surfaces. As the process contactless generates negligible joule heating, deposited free from heat affected zones has low internal stresses. This work presents free-flow jet micro-electrochemical (FJECAM) that deposits through continuous stream electrolyte. FJECAM accurate μm mm scale features without need expensive masking complex meniscus control as in traditional μECAM configurations. facilitates rapid surface modifications, 2D-2.5D shapes with high accuracy. In this paper, mechanism copper (Cu) stainless steel substrate (S.S.) during investigated characterization topography analysis current. The micro-deposits at different voltages scan rates were observed porosities minimum roughness 0.38 ± 0.02 was achieved rate (MDR) 16.06 μg/s 20 times higher than traditionally meniscus-confined (MECAM) same parameters.